We use polyimid or polyester base material, as base foil for the production of flexible PCB. In case of polyimid the width of raw material is expected to be 25-50 micron, in case of polyester 50-125 micron. The copper thickness can be between 18 and 35 micron. The production technology is similar to the traditional rigid PCB manufacturing. The most important thing is to avoid that the whole surface of the created circuit has the tin, tin-lead or gold plating. The cover on the copper can make the PCB panel brittle with losing its flexibility. Of course we use this technology on the pad and connectors. There is a possibility to create circuit, we can fix the components by soldering. In case of PET we should use smaller soldering surface (IC, resistance etc…) because the basic material can not bear the long soldering process, the base foil wrinkles. End mechanic process can happen by simple cutting, "stanz" or laser cutting.